"Post-bond test of Through-Silicon Vias with open defects."

Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras (2014)

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DOI: 10.1109/ETS.2014.6847816

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras:
Post-bond test of Through-Silicon Vias with open defects. ETS 2014: 1-6

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