"WIP: Building an Education Ecosystem for Next Generation Microelectronics ..."

Klaus Hofmann et al. (2024)

> Home

Details and statistics

DOI: 10.1109/FIE61694.2024.10893342

access: closed

type: Conference or Workshop Paper

metadata version: 2025-07-08

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/fie/HofmannKRMCWZCR24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/fie/HofmannKRMCWZCR24
Klaus Hofmann, Ferdinand Keil, David Riehl, Alicja Michalowska-Forsyth, Nikolaus Czepl, Sarah Woywod, Dominik Zupan, Mario R. Casu, Carlo Ricciardi, Massimo Violante, Mariagrazia Graziano, Yuri Ardesi, Fabrizio Mo, Dominik Berger, Sabine Sill, Volker Visotschnig, Panagiota Morfouli, Liliana Prejbeanu, Katell Morin-Allory, Cyrille Chavet, Davide Bucci, Skandar Basrour, Jean-Christophe Crebier, Nhu-Huan Nguyen, Ernesto Quisbert-Trujillo, Christian Defélix, Isabelle Corbett-Etchevers, Johannes Sturm, Jens Peter Konrath, Ulla Birnbacher, Thomas Klinger, Wolfgang Werth, Jorge Fernandes, Marcelino B. Santos, Antonio Rubio, Alba Pagès-Zamora, Josep Pegueroles, Jordi Salazar, Beatriz Otero, J. Manuel Moreno, X. Aragones, Israel Martin, Aleix Sole, Dunja Suttnig, Julia Calabro, Floriberto Lima, Eric Jouseau, François Cerisier, Cristian Rivier, Sepp Eisenriegler, Harald Reichl, Miroslav Macan, Dubravko Kruselj, Mladen Puskaric, Mirjana Tatalovic, Vinko Zelenicic, Bernd Deutschmann:
WIP: Building an Education Ecosystem for Next Generation Microelectronics Experts in Green and Circular Economy with Digitally-Supported Teaching Methods for Sustainable Chips and Applications (EU Project GreenChips-EDU). FIE 2024: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.