"Thermal analysis of a 3D die-stacked high-performance microprocessor."

Kiran Puttaswamy, Gabriel H. Loh (2006)

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DOI: 10.1145/1127908.1127915

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Kiran Puttaswamy, Gabriel H. Loh:
Thermal analysis of a 3D die-stacked high-performance microprocessor. ACM Great Lakes Symposium on VLSI 2006: 19-24

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