"TACPlace: Ultrafast Thermal-Aware Chiplet Placement with Feasibility Seeking."

Shan Yu et al. (2025)

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DOI: 10.1145/3716368.3735185

access: closed

type: Conference or Workshop Paper

metadata version: 2025-07-06

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Shan Yu, Haiyang Liu, Xinming Wei, Bizhao Shi, Guojie Luo:
TACPlace: Ultrafast Thermal-Aware Chiplet Placement with Feasibility Seeking. ACM Great Lakes Symposium on VLSI 2025: 600-605

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