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"Investigations of double layer UV-curing resin diamond wire saw."

Chunyan Yao et al. (2016)

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DOI: 10.1109/HSI.2016.7529645

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/hsi/YaoZQWXP16
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  - https://dblp.org/rec/conf/hsi/YaoZQWXP16
Chunyan Yao, Wei Zhang, Tengwei Qiu, Minghuan Wang, Xuefeng Xu, Wei Peng:
Investigations of double layer UV-curing resin diamond wire saw. HSI 2016: 284-288

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