"Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of ..."

TingYen Chiang, Kaustav Banerjee, Krishna Saraswat (2001)

> Home

Details and statistics

DOI: 10.1109/ICCAD.2001.968613

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/iccad/ChiangBS01
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iccad/ChiangBS01
TingYen Chiang, Kaustav Banerjee, Krishna Saraswat:
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects. ICCAD 2001: 165-

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.