"Study of dielectric material property impact on insertion loss for ..."

Bok Eng Cheah, H. Louis Lo, Jackson Kong (2015)

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DOI: 10.1109/ICCE-TW.2015.7216818

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-26

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Bok Eng Cheah, H. Louis Lo, Jackson Kong:
Study of dielectric material property impact on insertion loss for advanced packaging solutions. ICCE-TW 2015: 134-135

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