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"Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal ..."

Debika Chaudhuri et al. (2020)

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DOI: 10.1109/ICIIS51140.2020.9342651

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-09

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  - conf/iciis/ChaudhuriD0G20
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Debika Chaudhuri, Dalia Nandi Das, Hafizur Rahaman, Tamal Ghosh:
Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias. ICIIS 2020: 296-299

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