"Flexible Stretch-Free, Liquid-Sealed Packaging Method for Ultra-Thin ..."

Hao Liu et al. (2024)

> Home

Details and statistics

DOI: 10.1109/SENSORS60989.2024.10784631

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ieeesensors/LiuYTI24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ieeesensors/LiuYTI24
Hao Liu, Michitaka Yamamoto, Seiichi Takamatsu, Toshihiro Itoh:
Flexible Stretch-Free, Liquid-Sealed Packaging Method for Ultra-Thin Silicon-Based Bending Sensor. IEEE SENSORS 2024: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.