"Robust Time-of-Flight-based Material Imaging using Three-Dimensional Deep ..."

Rajababu Udainarayan Singh, Miguel Heredia Conde (2022)

> Home

Details and statistics

DOI: 10.1109/SENSORS52175.2022.9967293

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ieeesensors/SinghC22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ieeesensors/SinghC22
Rajababu Udainarayan Singh, Miguel Heredia Conde:
Robust Time-of-Flight-based Material Imaging using Three-Dimensional Deep Neural Networks on Spatial Neighborhoods of Pixels. IEEE SENSORS 2022: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.