"Fabrication of ultra-thin silicon chips using thermally decomposable ..."

Xingjun Xue et al. (2016)

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DOI: 10.1109/ICSENS.2016.7808438

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-08

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Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang:
Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. IEEE SENSORS 2016: 1-3

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