"Towards Intelligent Assembly and Manufacturing Environment - Modular ICT ..."

Minna Lanz et al. (2012)

> Home

Details and statistics

DOI: 10.1007/978-3-642-28163-1_19

access: open

type: Conference or Workshop Paper

metadata version: 2020-10-25

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - conf/ifip5-5/LanzJLGT12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ifip5-5/LanzJLGT12
Minna Lanz, Eeva Järvenpää, Pasi Luostarinen, Fernando García, Reijo Tuokko:
Towards Intelligent Assembly and Manufacturing Environment - Modular ICT Support for Holonic Manufacturing System. IPAS 2012: 154-162

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.