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"TDDB improvement of copper/dielectric in the highly-integrated BEOL ..."

Cheng Pu Chiu et al. (2015)

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DOI: 10.1109/IRPS.2015.7112701

access: closed

type: Conference or Workshop Paper

metadata version: 2023-01-24

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  dblp key:
  - conf/irps/ChiuLTWLCWHHLCC15
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  - https://dblp.org/rec/conf/irps/ChiuLTWLCWHHLCC15
Cheng Pu Chiu, Yen-Chun Liu, Bin-Siang Tsai, Yi-Jing Wang, Yeh-Sheng Lin, Yun-Ru Chen, Chien-Lin Weng, Sheng-Yuan Hsueh, Jack Hung, Ho-Yu Lai, Jei-Ming Chen, Albert H.-B. Cheng, Chien-Chung Huang:
TDDB improvement of copper/dielectric in the highly-integrated BEOL structure for 28nm technology node and beyond. IRPS 2015: 3

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