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"Localized thermal effects in Gate-all-around devices."

Colin Landon et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117903

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  dblp key:
  - conf/irps/LandonJPMKHS23
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  - https://dblp.org/rec/conf/irps/LandonJPMKHS23
Colin Landon, Lei Jiang, Daniel Pantuso, Inanc Meric, Kam Komeyli, Jeffrey Hicks, Daniel Schroeder:
Localized thermal effects in Gate-all-around devices. IRPS 2023: 1-5

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