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"Development and Product Reliability Characterization of Advanced High ..."

S. Lee et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117889

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  - conf/irps/LeeLLKJLHKP23
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S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae:
Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. IRPS 2023: 1-4

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