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"Demonstration on Warpage Estimation Approach Utilized in Fan-Out ..."

Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee (2023)

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DOI: 10.1109/IRPS48203.2023.10118246

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/irps/WangCL23
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Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee:
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. IRPS 2023: 1-4

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