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"Reliability degradation with electrical, thermal and thermal gradient ..."

Srijita Patra, Degang Chen, Randy Geiger (2013)

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DOI: 10.1109/ISCAS.2013.6572033

access: closed

type: Conference or Workshop Paper

metadata version: 2022-07-26

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Srijita Patra, Degang Chen, Randy Geiger:
Reliability degradation with electrical, thermal and thermal gradient stress in interconnects. ISCAS 2013: 1063-1066

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