"Analysis and mitigation of lateral thermal blockage effect of ..."

Yibo Chen et al. (2011)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2014-08-05

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  dblp key:
  - conf/islped/ChenKMJX11
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Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie:
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. ISLPED 2011: 397-402

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