"3D-Aware Low Power High-level Resource Binding and Co-Design."

Daniel H. Xing, Ankur Srivastava (2024)

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DOI: 10.1145/3665314.3670817

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-19

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Daniel H. Xing, Ankur Srivastava:
3D-Aware Low Power High-level Resource Binding and Co-Design. ISLPED 2024: 1-6

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