"Invited: Addressing Electromigration Challenges in 3D Integrated Circuit ..."

Ingo Kühn, Ivan Valentinov Petkov (2026)

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DOI: 10.1145/3764386.3779594

access: closed

type: Conference or Workshop Paper

metadata version: 2026-03-28

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Ingo Kühn, Ivan Valentinov Petkov:
Invited: Addressing Electromigration Challenges in 3D Integrated Circuit (3DIC) Wafer-On-Wafer Technology: EM analysis in 3DIC - status and challenges. ISPD 2026: 201-202

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