"A roadmap of CAD tool changes for sub-micron interconnect problems."

Louis Scheffer (1997)

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DOI: 10.1145/267665.267698

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Louis Scheffer:
A roadmap of CAD tool changes for sub-micron interconnect problems. ISPD 1997: 104-109

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