"A 0.29pJ/b 5.27Tb/s/mm UCIe Advanced Package Link in 3nm FinFET with 2.5D ..."

Didem Turker Melek et al. (2025)

> Home

Details and statistics

DOI: 10.1109/ISSCC49661.2025.10904754

access: closed

type: Conference or Workshop Paper

metadata version: 2025-04-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/isscc/MelekNVSPLGMMJB25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isscc/MelekNVSPLGMMJB25
Didem Turker Melek, R. Navinkumar, James Vandersand, Pyare Sarkar, BS Prakash, Adrian Leuciuc, Kevin Geary, Shaojun Ma, Chirag Mukesh Mehta, Shashi Jain, Basant Bothra, Pawan Sabharwal, Ranjan Vaish, Kirti Bhanushali, Yutong Ding, Craig Frost, John Annunziata, Krishanu Sadhu, Dimitris Kyritsis, Jeff Bostak, Ming Li, Steve Williams, Ken Chang:
A 0.29pJ/b 5.27Tb/s/mm UCIe Advanced Package Link in 3nm FinFET with 2.5D CoWoS Packaging. ISSCC 2025: 590-592

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.