"Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based ..."

Yukai Chen et al. (2024)

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DOI: 10.1109/ISVLSI61997.2024.00020

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type: Conference or Workshop Paper

metadata version: 2024-10-17

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Yukai Chen, Sankatali Venkateswarlu, Subrat Mishra, Julien Ryckaert, James Myers, Dwaipayan Biswas:
Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet. ISVLSI 2024: 45-50

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