"Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon ..."

Chun-Chuan Chi et al. (2011)

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DOI: 10.1109/TEST.2011.6139181

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu:
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base. ITC 2011: 1-10

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