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"A contactless testing methodology for pre-bond interposer."

Jianfei Jiang et al. (2015)

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DOI: 10.1109/MWSCAS.2015.7282074

access: closed

type: Conference or Workshop Paper

metadata version: 2022-06-22

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  dblp key:
  - conf/mwscas/JiangSWM15
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  - https://dblp.org/rec/conf/mwscas/JiangSWM15
Jianfei Jiang, Weiguang Sheng, Qin Wang, Zhigang Mao:
A contactless testing methodology for pre-bond interposer. MWSCAS 2015: 1-4

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