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"Metal film bridge with TSV-based 3D wafer level packaging."

Yunlong Guo, Wenzhong Lou, Xuran Ding (2015)

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DOI: 10.1109/NEMS.2015.7147460

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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  - conf/nems/GuoLD15
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Yunlong Guo, Wenzhong Lou, Xuran Ding:
Metal film bridge with TSV-based 3D wafer level packaging. NEMS 2015: 430-434

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