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"Electrical behavior on packaging module for the novel photoelectric sensor."

J. Q. Han et al. (2010)

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DOI: 10.1109/NEMS.2010.5592200

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-10

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  - conf/nems/HanWGXXZYZC10
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  - https://dblp.org/rec/conf/nems/HanWGXXZYZC10
J. Q. Han, Y. P. Wang, Fangmin Guo, B. Xu, D. Y. Xiong, M. C. Zhou, Y. C. Ye, Ziqiang Zhu, J. H. Chu:
Electrical behavior on packaging module for the novel photoelectric sensor. NEMS 2010: 233-236

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