"Full 3-inch Wafer Processed 1060 nm Single-mode Transverse Coupled-cavity ..."

Chang Ge et al. (2023)

> Home

Details and statistics

DOI: 10.23919/OFC49934.2023.10116351

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ofc/GeZ0KK23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ofc/GeZ0KK23
Chang Ge, Boxuan Zhang, Xiaodong Gu, Susumu Kinoshita, Fumio Koyama:
Full 3-inch Wafer Processed 1060 nm Single-mode Transverse Coupled-cavity VCSEL for Data Transmission in Standard 1300nm Single-mode Fiber. OFC 2023: 1-3

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.