"Multi-chip integration by photonic wire bonding: Connecting surface and ..."

Tobias Hoose et al. (2016)

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DOI: —

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type: Conference or Workshop Paper

metadata version: 2023-09-03

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Tobias Hoose, Muhammad Rodlin Billah, Matthias Blaicher, Pablo Marin, Philipp-Immanuel Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, Jörg Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos:
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC 2016: 1-3

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