"Wafer-scale High-Density Edge Coupling for High Throughput Testing of ..."

Robert Polster et al. (2018)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-11

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  dblp key:
  - conf/ofc/PolsterDJCLB18
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  - https://dblp.org/rec/conf/ofc/PolsterDJCLB18
Robert Polster, Liang Yuan Dai, Oscar A. Jimenez, Qixiang Cheng, Michal Lipson, Keren Bergman:
Wafer-scale High-Density Edge Coupling for High Throughput Testing of Silicon Photonics. OFC 2018: 1-3

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