"Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s ..."

Ying Zhao et al. (2021)

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type: Conference or Workshop Paper

metadata version: 2022-12-06

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Ying Zhao, Li Chen, Ricardo Aroca, Ninghui Zhu, Dinh Ton, David Inglis, Christopher Doerr:
Silicon Photonic Based Stacked Die Assembly for 4×200-Gbit/s Short-Reach Transmission. OFC 2021: 1-3

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