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"Coupled Power and Thermal Simulation with Active Cooling."

Weiping Liao, Lei He (2003)

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DOI: 10.1007/978-3-540-28641-7_11

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-13

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  dblp key:
  - conf/pacs/LiaoH03
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Weiping Liao, Lei He:
Coupled Power and Thermal Simulation with Active Cooling. PACS 2003: 148-163

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