"Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing ..."

Haoran Wen et al. (2018)

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DOI: 10.1109/PLANS.2018.8373389

access: closed

type: Conference or Workshop Paper

metadata version: 2020-09-05

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  - https://dblp.org/rec/conf/plans/WenDJGCLA18
Haoran Wen, Anosh Daruwalla, Yaesuk Jeong, Pranav Gupta, Jaehoo Choi, Chang-Shun Liu, Farrokh Ayazi:
Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip. PLANS 2018: 261-266

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