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"Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At ..."

Giuliano Sisto et al. (2021)

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DOI: 10.1109/SLIP52707.2021.00011

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/slip/SistoCCPBMM21
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  - https://dblp.org/rec/conf/slip/SistoCCPBMM21
Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic:
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited). SLIP 2021: 17-23

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