"Research on crosstalk issue of through silicon via for 3D integration."

Ting Kang et al. (2015)

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DOI: 10.1109/SOCC.2015.7406991

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Ting Kang, Zhaowen Yan, Wei Zhang, Jianwei Wang:
Research on crosstalk issue of through silicon via for 3D integration. SoCC 2015: 396-400

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