"High-Baudrate SiP and InP Modulators for Data Center Interconnects."

Oskars Ozolins et al. (2023)

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DOI: 10.23919/SOFTCOM58365.2023.10271574

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Oskars Ozolins, Armands Ostrovskis, Toms Salgals, Benjamin Krüger, Fabio Pittalà, Mahdieh Joharifar, Richard Schatz, Michael Koenigsmann, Yuchuan Fan, Urban Westergren, Haïk Mardoyan, Lu Zhang, Sandis Spolitis, Xianbin Yu, Markus Gruen, Vjaceslavs Bobrovs, Hadrien Louchet, Xiaodan Pang:
High-Baudrate SiP and InP Modulators for Data Center Interconnects. SoftCOM 2023: 1-3

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