"Effective and Efficient Testing of Large Numbers of Inter-Die ..."

Po-Yao Chuang et al. (2023)

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DOI: 10.1109/VTS56346.2023.10140006

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Po-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen:
Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages. VTS 2023: 1-6

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