"A Deep Transfer Learning Model for Packaged Integrated Circuit Failure ..."

Yao Lu, Qi Mao, Jingbo Liu (2021)

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DOI: 10.1109/ACCESS.2021.3118687

access: open

type: Journal Article

metadata version: 2021-11-03

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Yao Lu, Qi Mao, Jingbo Liu:
A Deep Transfer Learning Model for Packaged Integrated Circuit Failure Detection by Terahertz Imaging. IEEE Access 9: 138608-138617 (2021)

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