"Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu ..."

Sangwoo Park et al. (2025)

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DOI: 10.1109/ACCESS.2025.3534169

access: open

type: Journal Article

metadata version: 2025-02-14

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Sangwoo Park, Sangmin Lee, Junyoung Choi, Sarah Eunkyung Kim:
Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application. IEEE Access 13: 20160-20170 (2025)

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