"Thermal Performance Analysis of Carbon Materials Based TSV in Three ..."

Peng Xu et al. (2023)

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DOI: 10.1109/ACCESS.2023.3297222

access: open

type: Journal Article

metadata version: 2024-11-27

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Peng Xu, Huan Huang, Bing-Qi Zhang, Zheng-Hua Tang:
Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits. IEEE Access 11: 75285-75294 (2023)

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