Stop the war!
Остановите войну!
for scientists:
default search action
"Overlay High-Density Interconnect: A Chips-First Multichip Module Technology."
Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion (1993)
- Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion:
Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. Computer 26(4): 23-29 (1993)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.