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"Overlay High-Density Interconnect: A Chips-First Multichip Module Technology."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion (1993)

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DOI: 10.1109/2.206510

access: closed

type: Journal Article

metadata version: 2020-08-12

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  dblp key:
  - journals/computer/DaumBF93
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  persistent URL:
  - https://dblp.org/rec/journals/computer/DaumBF93
Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion:
Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. Computer 26(4): 23-29 (1993)

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