Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Wafer Scale Interconnections for GaAs Packing - Applications to RISC ..."

Jack F. McDonald et al. (1987)

> Home

Details and statistics

DOI: 10.1109/MC.1987.1663533

access: closed

type: Journal Article

metadata version: 2020-08-12

- view
  authority control:
- export record
  dblp key:
  - journals/computer/McDonaldGSDB87
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/computer/McDonaldGSDB87
Jack F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl:
Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. Computer 20(4): 21-35 (1987)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.