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"CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, ..."

Lokesh Siddhu et al. (2021)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2021-10-04

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-2109-12405
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2109-12405
Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda:
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. CoRR abs/2109.12405 (2021)

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