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"Thermal Modeling and Validation of a Real-World Mobile AP."

Young-Ho Gong, Jae Jeong Yoo, Sung Woo Chung (2018)

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DOI: 10.1109/MDAT.2017.2695958

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - https://dblp.org/rec/journals/dt/GongYC18
Young-Ho Gong, Jae Jeong Yoo, Sung Woo Chung:
Thermal Modeling and Validation of a Real-World Mobile AP. IEEE Des. Test 35(1): 55-62 (2018)

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