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"Effects of mechanical stress and moisture on packaging interfaces."

Stephen L. Buchwalter et al. (2005)

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DOI: 10.1147/RD.494.0663

access: closed

type: Journal Article

metadata version: 2021-02-17

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  - https://dblp.org/rec/journals/ibmrd/BuchwalterBFGLMQ05
Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad:
Effects of mechanical stress and moisture on packaging interfaces. IBM J. Res. Dev. 49(4-5): 663-676 (2005)

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