"A study on substrate noise coupling among TSVs in 3D chip stack."

Yuuki Araga et al. (2018)

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DOI: 10.1587/ELEX.15.20180460

access: open

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/ieiceee/AragaNVPB18
Yuuki Araga, Makoto Nagata, Joeri De Vos, Geert Van der Plas, Eric Beyne:
A study on substrate noise coupling among TSVs in 3D chip stack. IEICE Electron. Express 15(13): 20180460 (2018)

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