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"MSP based thermal-aware mapping approach for 3D Network-on-Chip under ..."

Gui Feng et al. (2016)

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DOI: 10.1587/ELEX.13.20160082

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
  - journals/ieiceee/FengGWZL16
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/FengGWZL16
Gui Feng, Fen Ge, Ning Wu, Lei Zhou, Jing Liu:
MSP based thermal-aware mapping approach for 3D Network-on-Chip under performance constraints. IEICE Electron. Express 13(7): 20160082 (2016)

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