"Capacitive pressure sensor with wafer-through silicon vias using SOI-Si ..."

Jun-Ku Kim, Chang-Wook Baek (2013)

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DOI: 10.1587/ELEX.10.20130453

access: open

type: Journal Article

metadata version: 2021-02-12

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Jun-Ku Kim, Chang-Wook Baek:
Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique. IEICE Electron. Express 10(15): 20130453 (2013)

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