"An enhanced time-to-digital conversion solution for pre-bond TSV dual ..."

Tianming Ni et al. (2019)

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DOI: 10.1587/ELEX.16.20181105

access: open

type: Journal Article

metadata version: 2025-10-10

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Tianming Ni, Hao Chang, Xian Sun, Xia Xiuzhen, Zhengfeng Huang:
An enhanced time-to-digital conversion solution for pre-bond TSV dual faults testing. IEICE Electron. Express 16(3): 20181105 (2019)

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